Mezzanine Şerit Konnektörler

The Q Strip® connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. Mated sets of the Q Strip® connectors are available in 8 different stack heights from 5 mm (.197") to 30 mm (1.180"). Options include guide posts for blind mate scenarios as well as alignment pins and locking clips for proper connector placement before reflow. 

• Performance: Up to 14.0 GHz /28 Gbps
• Integral ground/power plane
• Connector to connector retention options
• Vertical, perpendicular, and coplanar applications
• Contacts: Up to 180 I/Os
• Stack height: 5.00 mm - 25.00 mm

• Performance: Up to 10.5 GHz / 21 Gbps
• Optimized for 100 ohm systems
• Integral ground/power plane
• Stack height: 5.00-25.00 mm
• Contacts: Up to 100 pairs

• Performance: Up to 15 GHz / 30 Gbps
• Rugged Edge Rate® contacts
• Integral ground/power plane
• Up to 156 positions
• Slim footprint (less than 5.00 mm wide)

• Performance: Up to 8.5 GHz / 17 Gbps
• Increased insertion depth
• Dual stage hot pluggable
• Integral ground/power plane
• Shielded option available
• Power and RF ends options
• Contacts: Up to 208 I/Os
• Stack height: 10.00 mm - 16.00 mm

AcceleRate® HD ultra-dense, multi-row mezzanine strips are rated for 56 Gbps PAM4 on a 0.635 mm pitch. 

AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.

The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.

• Incredibly dense with up to 240 total I/Os
• Low profile 5 mm stack height
• Slim 5 mm width
• 4-row design; 10 - 60 positions per row (40 - 240 total positions)
• Edge Rate® contact system optimized for signal integrity performance
• Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
• Solder ball technology for simplified processing and self aligning
• Additional stack heights and higher pin counts in development

Samtec’s Edge Rate® contact system is designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating. 

• Edge Rate® contacts optimized for signal integrity performance
• 1.5 mm contact wipe
• Robust when "zippered" during unmating
• Up to 56 Gbps PAM4 performance
• 0.50 mm, 0.635 mm or 0.80 mm pitch systems
• Stack heights from 5 mm to 18 mm
• Extremely slim 2.5 mm body width on 0.635 mm pitch system
• 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system

• 10 stack height options from 5 mm to 12 mm
• Audible click when mated
• Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
• Up to 100 contacts