1.00 MM PITCH HIGH-SPEED EDGE CARD
- Performance up to 14 GHz / 28 Gbps
- Rugged Edge Rate® contacts decrease crosstalk and increase cycle life
- 20 – 140 total pins
- Accepts .062" (1.60 mm) thick cards
- Optional weld tab and alignment pin
Samtec’s Edge Rate® contact system is designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating.
The Q Strip® connectors have surface mount signal contacts as well as a surface mount ground plane between the two rows of signals for improved electrical performance. Mated sets of the Q Strip® connectors are available in 8 different stack heights from 5 mm (.197") to 30 mm (1.180"). Options include guide posts for blind mate scenarios as well as alignment pins and locking clips for proper connector placement before reflow.
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
SEARAY™ Open-Pin-Field Arrays feature a .050" x .050" (1.27 mm x 1.27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 560 Edge Rate® contacts. Vertical or right-angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50 Ω or 100 Ω solutions. High retention press-fit tails (SEAMP/SEAFP Series) and an 85 Ω tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec's high speed, high density riser (SEAR Series).