Razor Beam™ LP
- Ultra fine pitch – 0.40 mm and 0.50 mm
- Ultra low stack down to 2.00 mm
- Slim body design for increased board space savings
AcceleRate® HD ultra-dense, multi-row mezzanine strips are rated for 56 Gbps PAM4 on a 0.635 mm pitch.
AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.
The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.
These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.
They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.
Samtec’s Edge Rate® contact system is designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating.
As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.
BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.