Twinax Flyover™ Sistemleri

Samtec Flyover® systems can help extend signal reach and density to achieve next gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.

As bandwidth requirements rapidly increase, effectively managing heat and routing signals through lossy PCBs, vias and other components have become complex challenges.

Samtec Flyover® design breaks the constraints of traditional signaling substrate and hardware offerings, resulting in a cost–effective, high-performance and heat efficient answer to the challenges of 56 Gbps bandwidths and beyond.

Samtec's proprietary co-extruded Eye Speed® twinax cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling; improving signal integrity, bandwidth and reach for high-performance system architectures. 

• Ideal for 28-112+ Gbps applications
• Tight coupling between signal conductors
• Improved bandwidth and reach
• Improved signal integrity and eye pattern opening
• Low skew (< 3.5 ps/meter) over extended lengths

Dynamic Testing

Ultra low skew twinax cable underwent Dynamic Insertion and Return Loss testing, proving the cable to be rugged with stable electrical performance after 250 flex/bend cycles.

Cable Management

Samtec works with system architects in the early stages to optimize architecture for cable management while keeping signal integrity and thermals in mind.

• Reduced thermal challenges
• Simplified board layout
• 28 – 56 Gbps NRZ and beyond
• Eliminate expensive re-timers
• Fewer PCB layers
• Less expensive PCB materials

Samtec Flyover® design provides end option flexibility to create a high-speed application specific solution to meet next gen speeds.

• Press fit termination to the PCB board
• Ultra low 3 mm profile
• Supports and surpasses PCIe® Gen 3 speed at 2 meters
• 100 ohm differential pair signal routing
• 30 AWG twinax ribbon cable

Samtec’s Flyover QSFP Systems provide improved signal integrity and architectural flexibility by flying critical high-speed signals over lossy PCB materials and directly to the panel via ultra low skew twinax cable. The ultra-high-density design includes sideband signaling via press-fit contacts to help increase airflow, and a multitude of “End 2” options allow for maximum design flexibility.

Flyover QSFP

• 4 channels (x4 bidirectional, 8 differential pairs)
• ~100 Gbps NRZ aggregate (~200 Gbps PAM4)
• Compatible with all QSFP assemblies

Double Density Flyover QSFP

• 8 channels (x8 bidirectional, 16 differential pairs)
• ~200 Gbps NRZ aggregate (~400 Gbps PAM4)
• Belly-to-Belly mating for maximum density
• Backward compatible with QSFP modules

• Localized press-fit control and power contacts eliminate the need for a secondary cable and connector
• Sideband signals are routed through press-fit contacts for increased airflow

• One or two rows of contacts directly soldered to the cable
• Improved signal integrity by eliminating transition board and its variability
• Achieves tighter tolerances

• Ideal for 28-56+ Gbps applications
• Tight coupling between signal conductors
• Ultra low skew twinax < 3.5 ps/meter
• Samtec's Flyover Systems

• FireFly™ Micro Flyover System™
• Direct Connect Systems
• High-Speed Edge Card Systems
  • 0.80 mm Pitch
  • 0.50 mm Pitch
• ExaMAX® Backplane Systems

• Performance to 16 Gbps
• 100 ohm differential pair signal routing
• Micro 0.50 mm and 0.80 mm pitch
• .062" (1.60 mm) thick card
• Rugged metal latching and shielding
• Vertical and right-angle PCB connectors

The innovative design of NovaRay™ combines extreme density and extreme performance, which is critical as system sizes decrease and speeds increase. The fully shielded differential pair design and two reliable points of contact contribute to the industry leading 4.0 Tbps aggregate data rate.

• 112 Gbps PAM4 per channel
• 4.0 Tbps aggregate data rate - 9 IEEE 400G channels
• Innovative, fully shielded differential pair design enables:
  • Extremely low crosstalk (to 40 GHz)
  • Tight impedance control
  • Minimal variance in data rate as stack height increases
• 112 differential pairs per square inch
• Utilizes 40% less space than traditional arrays with the same data throughput
• BGA attach to board for greater density and optimized trace breakout region

• Guaranteed two points of contact ensure a more reliable connection
• Stub-free mating
• Signals lost at the first point are caught in the second
• Contributes to the 112 Gbps PAM4 rating
• 92 Ω solution addresses both 85 Ω and 100 Ω applications

AcceleRate® features an extremely slim 7.6 mm width and Eye Speed® ultra-low skew twinax cable with direct attach to the contacts. This eliminates the need and variability of a transition card for improved signal integrity.

The cable system also supports Samtec's flyover technology to fly data over lossy PCB, simplifying board layout and extending signal reach.

• Incredibly slim 7.6 mm width
• High-density 2-row design
• 8 and 16 differential pair configurations
• 34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable
• Mating board level socket (ARF6 Series) features standard rugged weld tabs for increased stability on the PCB
• Rugged metal latching and shielding
• Right-angle orientation in development

• Two rows of high-density contacts directly soldered to the cable
• Improved signal integrity by eliminating transition board and its variability
• Achieves tighter tolerances

Samtec’s proprietary co-extruded, low loss, twinax cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling, improving signal integrity, bandwidth and reach.

• Ideal for 28-56+ Gbps applications
• Tight coupling between signal conductors
• Ultra low skew twinax < 3.5 ps/meter

FireFly^™ Micro Flyover System™ is the first interconnect system that gives a designer the flexibility of using micro footprint high-performance optical and low-cost copper interconnects interchangeably with the same connector system.

Samtec FireFly^™ copper and optical cable systems provide the flexibility to achieve higher data rates to 28 Gbps and/or greater distances, simplifying board design and enhancing performance.

The system’s miniature footprint allows for greater density and closer proximity to the IC, enabling chip-to-chip, board-to-board, on-board and system-to-system connectivity.

The ExaMAX^® contact system achieves two reliable points of contact at all times and minimizes residual stub for improved signal integrity performance, while providing low mating force and excellent contact normal force. Signal wafers incorporate a one-piece, embossed ground structure which improves crosstalk performance.

Traditional backplane and direct-mate orthogonal available with backplane cable and coplanar versions in development.

• Enables 56 Gbps electrical performance on 2.00 mm column pitch
• Meets industry specifications such as PCI Express^®, Intel OPI abd UPI, SAS, SATA, Fibre Channel, Infini Band^™ and Ethernet
• Meets and exceeds OIF CEI-28G-LR specification for 28 Gbps standards
• Direct-mate orthogonal eliminates the need for a backplane/midplane and shortens the signal path for improved sgnal integrity
• Allows designers to optimize density or minimize board layer count
• Samtec Teraspeed Consulting
  • Experts in design, optimization, and evaluation of high speed backplane systems
• Offerings:
  • Traditional Backplane
  • Backplane Cable
  • Direct-mate orthogonal
  • Coplanar

• Two reliable points of contact
  • Even when subjected to angled mating
• Meets Telecordia GR-1217 CORE specification
• 2.4 mm mating surface area (contact wipe)
• Minimizes residual stub
• Clear separation between contact points
• Lowest mating force on the market
• Excellent contact normal force

• Individual signal wafers
  • Staggered, differential pair design
  • 24-72 pairs
• Ground Plane
  • One-piece, embossed ground structure
  • Increased isolation significantly reduces crosstalk
  • Ground signal placement engineered for 92Ω impedance
    • Addresses both 85 and 100Ω applications
  • Balanced differential pairs are arranged in columns with zero skew

• Fully protected terminals on both backplane and daughtercard connectors ensure stub-free mating
• Hermaphroditic mating interface provides reliable mating, protects pins

• Mating force: 0.36 N max per contact
• Unmating force: 0.12 N min per contact
• Current rating: 0.5 A per signal contact
  • 0 < 30 ᵒC temp rise above ambient
• -55 ᵒC to +85 ᵒC operating temperature
• Press-fit termination
• Discrete or integrated guidance, keying and power modules available
• Manufacturing friendly 0.36 mm PTH for signals and 0.50 mm for grounds