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Samtec’s Edge Rate® contact system is designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating. 

• Edge Rate® contacts optimized for signal integrity performance
• 1.5 mm contact wipe
• Robust when "zippered" during unmating
• Up to 56 Gbps PAM4 performance
• 0.50 mm, 0.635 mm or 0.80 mm pitch systems
• Stack heights from 5 mm to 18 mm
• Extremely slim 2.5 mm body width on 0.635 mm pitch system
• 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system

• Provides 0.50 mm (.0197") float in X and Y directions
• Ideal for multiple connectors on a board
• Up to 60 floating contacts
• Choice of body height and right-angle design

• Performance: Up to 8.5 GHz / 17 Gbps
• Increased insertion depth
• Dual stage hot pluggable
• Integral ground/power plane
• Shielded option available
• Power and RF ends options
• Contacts: Up to 208 I/Os
• Stack height: 10.00 mm - 16.00 mm

• Performance: Up to 15 GHz / 30 Gbps
• Rugged Edge Rate® contacts
• Integral ground/power plane
• Up to 156 positions
• Slim footprint (less than 5.00 mm wide)

• 10 stack height options from 5 mm to 12 mm
• Audible click when mated
• Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
• Up to 100 contacts