The ExaMAX® contact system achieves two reliable points of contact at all times and minimizes residual stub for improved signal integrity performance, while providing low mating force and excellent contact normal force. Signal wafers incorporate a one-piece, embossed ground structure which improves crosstalk performance.
Traditional backplane and direct-mate orthogonal available with backplane cable and coplanar versions in development.
These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.
They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.
The innovative design of NovaRay™ combines extreme density and extreme performance, which is critical as system sizes decrease and speeds increase. The fully shielded differential pair design and two reliable points of contact contribute to the industry leading 4.0 Tbps aggregate data rate.
| Aggregate Data Rate | 448 Gbps | 672 Gbps | 896 Gbps | 896 Gbps | 1344 Gbps | 1792 Gbps | 4032 Gbps* |
| Total No. of Banks | 1 | 1 | 1 | 2 | 2 | 2 | 3* |
| Total No. of Rows | 2 | 3 | 4 | 2 | 3 | 4 | 6* |
| Total No. of Pairs | 8 | 12 | 16 | 16 | 24 | 32 | 72* |
Samtec's SEARAY™ products are the industry's largest offering of high speed, high density open-pin-field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
SEARAY™ Open-Pin-Field Arrays feature a .050" x .050" (1.27 mm x 1.27 mm) pitch grid for maximum grounding and routing flexibility. This system is available in stack heights from 7 mm to 40 mm with up to 560 Edge Rate® contacts. Vertical or right-angle arrays (SEAM/SEAF Series) and a mating high speed cable assembly (SEAC Series) are available as 50 Ω or 100 Ω solutions. High retention press-fit tails (SEAMP/SEAFP Series) and an 85 Ω tuned interconnect (SEAMI Series) offer greater system flexibility. Elevated board stacking up to 40 mm is achieved by Samtec's high speed, high density riser (SEAR Series).
These ultra high density, high speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.
The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.
As a high-speed, high-density connector, Z-Ray® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray® is a cost-saving removable interface between the IC package and main board. Z-Ray® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.
BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.
